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In-depth illustration of M3 dust-free paper material formula: 5 core technologies help industrial cleaning upgrade

Apr 16, 2025 Knowledge Base Wipestar

As the core consumable in the field of precision manufacturing, M3 dust-free paper plays an irreplaceable role in key processes such as semiconductor wafer cleaning, optical lens wiping, and PCB board cleaning with its unique material combination and process design. The following deeply analyzes the technical characteristics of five mainstream material formulas to help industrial users choose the best solution according to the specific working conditions.

[Composite fiber type: Viscose dominant formula] Dust-free paper made of 70% viscose + 20% polyester + 10% ES material adopts a 22-mesh spun lace mesh molding process, which performs excellently in medical equipment assembly and laboratory precision instrument maintenance. Its three-dimensional fiber structure can absorb liquids equivalent to three times its own weight, and with the ability to capture particles at level 0.3μm, it is especially suitable for sterile environmental maintenance of biopharmaceutical companies.

M3-dust-free-paper

[All polyester reinforced] 100% polyester material M3 dust-free paper uses molecular chain orientation arrangement technology to form a wear-resistant layer similar to a honeycomb structure. After ASTM D3886 standard test, its surface wear resistance index reaches 180% of the industry benchmark value. In automobile manufacturing spray workshops and metal processing dust treatment, a single product can be used continuously for more than 8 hours without fiber falling off.

【Dioxide polyester composite type】The gold ratio scheme of 20% viscose and 80% polyester is achieved by balancing cleaning efficiency and durability through a 25-mesh encrypted mesh design. The actual application data of this material on the LCD panel production line shows that compared with traditional non-woven fabrics, the particle residue is reduced by 72%, which is particularly suitable for the ultimate cleaning process before AMOLED screen packaging.

[Pure Viscose Precision] A fully viscose material treated with AX micromesh showed an extremely low chip loss rate of 0.09mg/m³ in the Class 10 clean room test of the semiconductor FAB factory. After the surface of the fiber is modified by plasma, the electrostatic particles can be effectively adsorbed, and the process yield rate can be increased by 1.2 percentage points in the wafer cutting process.

[Multifunctional composite] Innovative 30% polyester + 60% viscose + 10% low melting point formula, a gradient density structure is formed through hot melt composite technology. This design allows it to meet the cleaning requirements of the MIL-STD-1246C standard when cleaning precision components of aerospace, and can withstand the working temperature of the hydraulic system at 80℃, making it a versatile player under complex working conditions.

M3 dust-free paper with different materials is like a "special force" in the field of industrial cleaning. From the electrostatic control of electronic component production lines to the surface treatment of photovoltaic panels, each formula corresponds to specific technical challenges. For example, in the production of lithium battery electrodes, all polyester materials can effectively remove graphite dust; while in optical coating workshops, pure viscose formulations can ensure zero damage to the nanoscale surface. Understanding the engineering principles behind these material properties will help technicians develop more scientific cleaning solutions.

Professional technical support service If you have not determined which dust-free paper is the best suitable for your application scenario, it is recommended to inform our technical team of the specific working conditions parameters.

According to industry statistics, there are differentiated demands for dust-free paper weight, fiber density and electrostatic control indicators of production environments with different clean levels. Taking the electronic component assembly workshop as an example, it is usually necessary to use professional consumables such as M3 dust-free paper with low squash rate (<0.1mg/m³) and IPX4-level moisture-proof performance.

Free sample testing plan We specifically provide a comparison test set containing 5 M-3 series dust-free papers, covering a variety of specifications of 80-120g/m². Actual cases show that through this test plan, medical device packaging companies can accurately match the product surface treatment process requirements, saving an average of 37% of the material testing cycle. These samples are all packaged in vacuum antifouling, and are supported for delivery within 48 hours in major industrial areas across the country.

Scientific selection guidance suggests that when encountering special scenarios such as precision optical instrument cleaning or semiconductor packaging, it is recommended to provide key parameters such as ambient temperature and humidity, contact material type and cleaning frequency simultaneously.

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