The difference between dust-free paper and wiping paper is revealed. 15 years of experience in the field of materials, processes and characteristics

In the field of industrial cleaning consumables, dust-free paper and wipe paper are two core products often cause confusion among users. As a clean material expert with 15 years of industry experience, we will analyze the essential differences between the two from the perspective of material engineering and help enterprises accurately choose suitable cleaning solutions.

The difference in core materials determines the characteristics of the product. Dust-free paper uses a composite process of 55% needle wood pulp and 45% polyester fiber (called the earlier process in the industry), and its essence belongs to the category of nonwoven materials. In contrast, the wipe paper strictly follows the papermaking process standards and is made of 100% bleached sulfate wood pulp. This material difference makes dust-free paper have the physical characteristics of cloth-like fabrics, and its longitudinal tensile strength can reach 12N/15mm (tested according to the ASTM D5035 standard), which is more suitable for mechanical wipe scenarios.

Comparison of performance parameters reveals the application boundaries From the perspective of liquid absorption performance, wipe paper has excellent performance with its pure cellulose structure. The single-layer gram weight of 60g/m² can absorb liquid to 8 times its own weight. Due to the hydrophobic properties of polyester fiber, the liquid absorption volume is maintained in the range of 4–5 times, but its unique fiber cross-linking structure gives the product excellent wear resistance - in the Taber wear resistance test, dust-free paper can withstand wear of 2,000 rpm and maintain its complete form, which is difficult for ordinary wipes to achieve.

Scenario-based application matching industry demands The electronic manufacturing industry generally uses dust-free paper for PCB board cleaning, and its low dust generation characteristics (compliant with IEST-RP-CC004.3 standard) can effectively control microparticle pollution. Taking semiconductor wafer cleaning as an example, operators often use dust-free paper to remove process residues with isopropanol. Automobile repair workshops prefer wipe paper to treat oil stains. Its high fluffy fiber structure can quickly absorb viscous liquids such as 40# engine oil, and the single wipe area can reach 0.35 square meters.

The key indicators of clean grade adaptation are under the framework of ISO 14644-1. Dust-free paper is suitable for Class 100,000 (Fed-Std-209E equivalent) clean environment, but it should be noted that the release amount of particles above 0.3 μm is about 200 pieces per square foot. Professional grade low-dust wipes are processed through a special hydros pinning process to control particle release to within 50 pieces per square foot, meeting the needs of Class 10,000 clean rooms. These products are usually marked with blue edges as identification marks.

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